Electroninks Launches Revolutionary Copper MOD Ink for Semiconductor Packaging

04 September, TaiwanElectroninks, a leader in metal organic decomposition (MOD) inks, has unveiled a groundbreaking copper MOD ink at SEMICON Taiwan 2024. This innovative product is set to transform advanced semiconductor packaging by offering significantly faster production speeds, reduced costs, and enhanced sustainability.

The new copper ink is designed to replace traditional electroless copper plating and physical vapor deposition (PVD) processes, both of which are resource-intensive. Instead, Electroninks' copper ink allows for additive printing, which reduces water and energy consumption and requires a smaller factory footprint. These advancements give manufacturers a lower total cost of ownership and higher return on investment, addressing the industry's growing demand for sustainable and efficient solutions.

The ink can be applied using various conventional printing methods such as spray coating, screen printing, and inkjet, offering flexibility in different manufacturing setups. One key application for this copper MOD ink is in seed layer printing for fine-line metallization and redistribution layer (RDL) formation, where it drastically improves manufacturing throughput.

Electroninks CEO Brett Walker highlighted the ink's potential for reducing environmental impact while boosting cost-efficiency. "Our copper MOD ink expands our portfolio and meets customer demands for both sustainability and performance," he said. Jim Haley, Vice President of Marketing, also emphasized how this copper-based solution aligns with industry trends, noting copper's widespread use in electronic design.

The company offers different grades of copper ink, ensuring compatibility with various substrates such as glass, silicon, and EMC. These inks can be cured at low temperatures, making them suitable for a range of advanced packaging applications.

Electroninks will be showcasing its copper MOD ink at booth Q5152 during SEMICON Taiwan, providing manufacturers a closer look at this innovative technology.